時間:2024-01-22 19:06來源:未知 作者:航空
表1:Ti6Al4V L-PBF底盤插件輕量化設計的脆弱性和增材制造可行性
案例研究結果分析 ◉ 依據ASTM F2924-14,L-PBF Ti6Al4V的常規(guī)HIP工藝通過對打印過程中產生的典型缺陷致密化,可有效地使HCF強度達到600MPa(R=-1,N=106)。 ◉ L-PBF Ti6Al4V在常規(guī)HIP溫度895-955°C時的高溫軟化可以通過800°C/200MPa的低溫HIP工來避免。這樣材料的HCF強度可達750MPa(R=-1,N=107),并保持與高溫去應力材料相同的屈服強度(Rp0.2 > 950MPa)。該工藝適用于尺寸小于300µm的缺陷。 ◉ 為了致密1-2mm的大孔(這會發(fā)生在L-PBF高速構建時),并最大化屈服強度(Rp0.2 > 1000MPa),可將先進的高壓熱處理(HPHT = HIP+STA)成功應用于高性能AM零件。
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